Technologies & Manufacturing
SIAE MICROELETTRONICA is very proud of its highly skilled RF design department and advanced laboratory facilities, with over 25 years experience in microwave circuits productions and high quality thin film customisations. This division is the leader in the production of ceramic, glass, quartz or nitride aluminium substrates using sputtering deposition.
Manufacturing in the Technological Department (i.e. clean room area) is based on a modular assembly practice, starting with highly sophisticated automatic bare chip or packaged device attachment to the substrate (both ceramic or soft board) and relative high speed wire or ribbon bonding.
For special applications, device attachment can be done through SnAu (or equivalent) eutectic alloy, the module can be hermetically sealed and subsequently 100% tested for gross and fine leakage.
CLEAN ROOM QUALITY CONTROLA dedicated quality procedure is applied to all of the activities of the technological department in order to ensure the correct accuracies required by the millimetric frequency applications of the V,E,W-bands are achieved:
Nano-Metric accuracy for sputtered layer (one in five unit test)
Micro-Metric accuracy for chip and wire process (100% inline dimension automatic test)
Electrical performance test (100% inline for Tx/Rx and SIPs)
Tape and Reel (all SIPs which passed relevant electrical tests are automatically tape and reel assembled)